Integrated compact in-package light engine

ABSTRACT

An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication with median-or-short-reach electrical interconnect.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of and claims priority toU.S. patent application Ser. No. 16/706,450, filed on Dec. 6, 2019,commonly assigned and hereby incorporated by references for allpurposes.

BACKGROUND OF THE INVENTION

The present invention relates to optical telecommunication techniques.More particularly, the present invention provides a compact opticaltransceiver based on silicon photonics platform, a light engine withcompact on-board in-package optics assembly, or a light engineintegrated with a switch device in a co-packaged optics assembly, and anoptical-electrical system having the same.

As science and technology are updated rapidly, processing speed andcapacity of the computer increase correspondingly. The communicationtransmission or reception using the traditional cable is limited tobandwidth and transmission speed of the traditional cable and massinformation transmission required in modern life causes the traditionalcommunication transmission overload. To correspond to such requirement,the optical fiber transmission system replaces the traditionalcommunication transmission system gradually. The optical fibercommunication is chosen for systems requiring higher bandwidth andlonger distance that electrical cable cannot accommodate. Presentelectronic industrial performs research toward optical transmissionwhich will become the mainstream in the future even for short distancecommunication. Said optical communication is a technology in that lightwave functions as signal carrier and transmitted between two nodes viathe optical fiber. An optical communication system includes an opticaltransmitter and an optical receiver. By the optical transceiver, thereceived optical signal can be converted to an electrical signal capableof being processed by an IC, or the processed electrical signal can beconverted to the optical signal to be transmitted via optical fiber.Therefore, objective of communication can be achieved.

Over the last few decades, the use of communication networks exploded.In the early days Internet, popular applications were limited to emails,bulletin board, and mostly informational and text-based web pagesurfing, and the amount of data transferred was usually relativelysmall. Today, Internet and mobile applications demand a huge amount ofbandwidth for transferring photo, video, music, and other multimediafiles. For example, a social network like Facebook processes more than500 TB of data daily. With such high demands on data and data transfer,existing data communication systems need to be improved to address theseneeds.

40-Gbit/s and then 100-Gbit/s data rates wide-band WDM (WavelengthDivision Multiplexed) optical transmission over existing single-modefiber is a target for the next generation of fiber-optic communicationnetworks. Chip-scale widely-tunable lasers have been of interest formany applications such as wide-band DWDM or CWDM communication andwavelength-steered light detection. More recently, optical componentsare being integrated on silicon (Si) substrates for fabricatinglarge-scale photonic integrated circuits that co-exist withmicro-electronic chips. a whole range of photonic components, includingfilters, (de)multiplexers, splitters, modulators, and photodetectors,have been demonstrated, mostly in the silicon-on-insulator (SOI)platform. The SOI platform is especially suited for standard DWDMcommunication bands around 1550 nm or CWDM communication band around1310 nm, as silicon (n=3.48) and its oxide SiO₂ (n=1.44) are bothtransparent, and form high-index contrast, high-confinement waveguidesideally suited for medium to high-integration planar integrated circuits(PICs).

With the advances of optical communication technology and applicationsdriven by the market, the demands become stronger on increasingbandwidth for optical communication and decreasing package footprint ofan optical transceiver. It is more and more challenging to integrate allnecessary components within smaller and smaller module package. For thestate-of-art optical transceiver products, all the critical componentsincluding clock data recovery (CDRs), modulator drivers, transimpedanceamplifiers (TIAs), and PLC photonics chips having optical passives,modulators, and photo detectors, are assembled side-by-side on a PCB ina 2D fashion. This approach has at least two drawbacks for developingany future optical transceiver with data rate greater than 400G.Firstly, the side-by-side placement of the components consumes much ofthe board area for optical transceiver as a pluggable product or majorsubstrate area for on-board optics product, making it very difficult tofurther shrink the product size. Secondly, side-by-side placement on thePCB creates longer electrical transmission length and often requireswire bonds between electrical die and photonics die, introducing moreelectrical loss which damages signal integrity for very high data ratetransceiver product, e.g., >56 Gbaud symbol rate. In particular, thewire bonds lead to impedance mismatch due to large inductance, degradingthe signal at higher frequencies. As such, it is not practical to usewirebond as electrical interconnect between chips or between chips andboard for the applications where high frequency (e.g., >40 GHz) analogsignal is transmitted. The large inductance of wire bonds has become abottle neck of high-speed signal transmission.

To shorten the interconnect length of conventional wire bonds betweenelectronics devices (e.g., from LD driver/TIA to digital signalprocessor DSP) or between electronics (driver/TIA) and photonics (e.g.,CDR and PAM4 ASIC), people have started to use through-silicon via (TSV)process in Si photonics die to replace wire bonds and makeinterconnections. However, the complexity of manufacturing process, lowyield, inefficient wafer area usage, and very expensive in scaling toadvanced electronics making the TSV process impractical for making Siphotonics field product. It is desirable to have a compact opticalengine that is provided with an improved on-board package scheme thatenjoys the high-performance benefit of a 3D multichip stackingintegration with much shorter interconnect and lower parasitic whilekeeping the packaging process simple and cost low. Further the opticalengine can be co-integrated with switches in high data ratecommunication applications to meet the requirement of ever-increasingbandwidth between electronics and photonics.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to optical telecommunication techniques.More particularly, the present invention provides an integrated opticaltransceiver based on silicon-photonics platform. Merely by example, thepresent invention discloses an on-board, in-package optics light enginebased on four integrated optical transceivers each configured with 4CWDM channels plus 4 replicated CWDM channels, a compact light engineintegrating multiple optical-electrical modules, and a multi-channellight engine having one switch device integrated with multiple compactoptical-electrical modules in a co-packaged optics assembly forhigh-speed opto-electrical data communication up to total 51.2 Tbit/s,though other applications are possible.

In modern electrical interconnect systems, high-speed serial links havereplaced parallel data buses, and serial link speed is rapidlyincreasing due to the evolution of CMOS technology. Internet bandwidthdoubles almost every two years following Moore's Law. But Moore's Law iscoming to an end in the next decade. Standard CMOS silicon transistorswill stop scaling around 3 nm. And the internet bandwidth increasing dueto process scaling will plateau. But Internet and mobile applicationscontinuously demand a huge amount of bandwidth for transferring photo,video, music, and other multimedia files. This disclosure describestechniques and methods to improve the communication bandwidth beyondMoore's law.

In an embodiment, the present invention provides an integrated opticaltransceiver. The integrated optical transceiver includes a substratemember having a surface region, an optical input port, and an opticaloutput port. Additionally, the integrated optical transceiver includes atransmitter unit provided on the surface region. The transmitter unitincludes a set of four laser devices comprising four laser diode chipsflip-mounted on the surface region and configured to output four laserlights respectively at four wavelengths centered at 1270 nm, 1290 nm,1310 nm, and 1330 nm. The transmitter unit further includes a set offour power splitter devices coupled to the four laser lights to spliteach of the four laser lights to two portions leading to two replicatedtransmit paths. Each transmit path includes a set of four modulatordevices formed in the surface region and respectively receivingcorresponding one of the two portions of the four laser lights. Eachtransmit path further includes a driver device coupled to the set offour modulator devices and configured to drive each modulator device tomodulate a respective one of the four laser lights. Additionally, eachtransmit path includes a multiplexer device in a planar light circuitdisposed next to the substrate member and configured to couple the fourlaser lights and multiplex to one output light carrying the fourwavelengths delivered to the optical output port. Furthermore, theintegrated optical transceiver includes a receiver unit provided on thesurface region with two replicated receive paths. Each receive pathincludes a demultiplexer device in the planar light circuit configuredto receive an input light from the optical input port and demultiplex tofour input optical signals with the four wavelengths. Each receive pathfurther includes four input waveguides formed in the surface regioncoupled to the demultiplexer device to respectively receive the fourinput optical signals. Additionally, each receive path includes aphotodetector device converted the four input optical signals torespective electrical signals and a transimpedance amplifier devicecoupled to the photodetector device to process the electrical signals tobe transferred as electrical outputs. Moreover, the integrated opticaltransceiver includes a heterogeneous integration configured using thesubstrate member, the transmitter unit, and the receiver unit to form asingle silicon photonics device.

In a specific embodiment, the present invention provides a compact lightengine. The compact light engine includes a case having a periphery wallmember coupled with a top lid member and a single printed circuit boardconfigured as a bottom member. The compact light engine further includesfour optical-electrical modules respectively disposed on the singleprinted circuit board. Each optical electrical module includes anintegrated optical transceiver described herein. The integrated opticaltransceiver includes a transmitter unit and a receiver unit configuredin a surface region of a silicon substrate. The transmitter unitincludes four laser devices outputting four laser lights split to tworeplicated transmit paths and a driver device to drive four modulatorsto modulate the four laser lights per each transmit path coupled with anoptical multiplexer device in a planar light circuit (PLC) based on aglass substrate to output a transmission light. The receiver unitincludes two replicated receive paths. Each receive path includes aphotodetector device and a trans-impedance amplifier device to detectfour light signals inputted from an optical demultiplexer device in thePLC and convert the four light signals to respective electrical signals.Additionally, the compact light engine includes an input fiber cablecoupled to each receive path with the optical demultiplexer device inthe PLC per one of the four optical-electrical modules and an outputfiber cable coupled to each transmit path with the optical multiplexerdevice in the PLC per the one of the four optical-electrical modules.The compact light engine further includes a first connector disposed ata side region of the periphery wall member to couple with two pairs ofinput fiber cables and output fiber cables respectively associated withtwo of the four optical-electrical modules. Furthermore, the compactlight engine includes a second connector disposed at a side region ofthe periphery wall member to couple with two pairs of input fiber cablesand output fiber cables respectively associated with other two of thefour optical-electrical modules. Moreover, the compact light engineincludes one or more ASIC chips configured on the printed circuit boardand electrically coupled with the four optical-electrical modules.

In another specific embodiment, the present invention provides amulti-channel light engine in an optics assembly. The multi-channellight engine includes a common substrate member having a peripheryregion and a central region. The multi-channel light engine furtherincludes a switch device disposed at the central region having aplurality of electrical interconnects embedded in the common substratemember. Additionally, the multi-channel light engine includes multiplecompact light engines disposed along the periphery region to maximizeuseable spaces of the common substrate thereof. Each compact lightengine is coupled with the switch device via one or more electricalinterconnects of the plurality of electrical interconnects. Each compactlight engine includes a case having a periphery wall member coupled witha bottom substrate member and a top lid member. Each compact lightengine further includes four optical-electrical modules mounted on asingle printed circuit board associated with the bottom substratemember, each optical electrical module comprising an integrated opticaltransceiver described herein. The integrated optical transceiver isconfigured in a surface region of a silicon substrate including tworeplicated transmit paths including four splitters splitting four laserdevices outputting four laser lights to two replicated sets of fourlight signals respectively carrying four CWDM wavelengths. Theintegrated optical transceiver is configured in the surface region ofthe silicon substrate also including two replicated receive pathsreceiving two independent incoming light signals each carrying the fourCWDM wavelengths. Each transmit path includes a driver device to drivefour modulators to modulate one set of four light signals muxed by anoptical multiplexer device planar light circuit (PLC) based on a glasssubstrate to output a transmission light. Each receive path includes aphotodetector device and a trans-impedance amplifier device to detectlight signals demuxed from one incoming light signal by an opticaldemultiplexer device in the PLC and convert the light signals toelectrical signals. Additionally, each compact light engine includes afirst fiber to couple with an input waveguide of the opticaldemultiplexer device in the PLC and a second fiber to couple with anoutput waveguide of the optical multiplexer device in the PLC.Furthermore, each compact light engine includes an optical connectorintegrated with the top lid member and located at one side of theperiphery wall member to couple with each first fiber associated witheach of the four optical-electrical modules and each second fiberassociated with each of the four optical-electrical modules.

The present invention achieves these benefits and others in the contextof known waveguide laser modulation technology. However, a furtherunderstanding of the nature and advantages of the present invention maybe realized by reference to the latter portions of the specification andattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following diagrams are merely examples, which should not undulylimit the scope of the claims herein. One of ordinary skill in the artwould recognize many other variations, modifications, and alternatives.It is also understood that the examples and embodiments described hereinare for illustrative purposes only and that various modifications orchanges in light thereof will be suggested to persons skilled in the artand are to be included within the spirit and purview of this process andscope of the appended claims.

FIG. 1 is a simplified block diagram of an integrated compact opticaltransceiver according to an embodiment of the present invention.

FIG. 2 shows a schematic perspective view of a compact light engineassembly integrating four optical-electrical modules according to anembodiment of the present invention.

FIG. 2A shows a schematic explosive view of a package of a quarterassembly of a compact light engine according to an embodiment of thepresent invention.

FIG. 3 is a schematic cross-sectional view of an optical-electricalmodule based on the silicon photonics TSV interposer according to anembodiment of the present invention.

FIG. 4A is a schematic side view of a light engine with a switchco-mounted with an optical-electrical module in an on-board in-packageoptics assembly according to an embodiment of the present invention.

FIG. 4B is a schematic side view of a light engine with a switchco-integrated with an optical-electrical module in co-packaged opticsassembly according to an embodiment of the present invention.

FIG. 5 is a schematic perspective view of a multi-channel integratedlight engine including one switch device co-mounted with multiplecompact light engines in an on-board in-package optics assemblyaccording to an embodiment of the present invention.

FIG. 6 is a simplified cross-sectional view of a section of themulti-channel light engine in the on-board in-package optics assemblyaccording to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to optical telecommunication techniques.More particularly, the present invention provides an integrated opticaltransceiver based on silicon-photonics platform. Merely by example, thepresent invention discloses an on-board, in-package optics light enginebased on four integrated optical transceivers each configured with 4CWDM channels, a compact light engine integrating multipleoptical-electrical modules, and a multi-channel light engine having oneswitch device integrated with multiple compact optical-electricalmodules in a co-packaged optics assembly for high-speed opto-electricaldata communication up to total 51.2 Tbit/s, though other applicationsare possible.

The following description is presented to enable one of ordinary skillin the art to make and use the invention and to incorporate it in thecontext of particular applications. Various modifications, as well as avariety of uses in different applications will be readily apparent tothose skilled in the art, and the general principles defined herein maybe applied to a wide range of embodiments. Thus, the present inventionis not intended to be limited to the embodiments presented, but is to beaccorded the widest scope consistent with the principles and novelfeatures disclosed herein.

In the following detailed description, numerous specific details are setforth in order to provide a more thorough understanding of the presentinvention. However, it will be apparent to one skilled in the art thatthe present invention may be practiced without necessarily being limitedto these specific details. In other instances, well-known structures anddevices are shown in block diagram form, rather than in detail, in orderto avoid obscuring the present invention.

The reader's attention is directed to all papers and documents which arefiled concurrently with this specification and which are open to publicinspection with this specification, and the contents of all such papersand documents are incorporated herein by reference. All the featuresdisclosed in this specification, (including any accompanying claims,abstract, and drawings) may be replaced by alternative features servingthe same, equivalent or similar purpose, unless expressly statedotherwise. Thus, unless expressly stated otherwise, each featuredisclosed is one example only of a generic series of equivalent orsimilar features.

Furthermore, any element in a claim that does not explicitly state“means for” performing a specified function, or “step for” performing aspecific function, is not to be interpreted as a “means” or “step”clause as specified in 35 U.S.C. Section 112, Paragraph 6. Inparticular, the use of “step of” or “act of” in the Claims herein is notintended to invoke the provisions of 35 U.S.C. 112, Paragraph 6.

Please note, if used, the labels left, right, front, back, top, bottom,forward, reverse, clockwise and counter-clockwise have been used forconvenience purposes only and are not intended to imply any particularfixed direction. Instead, they are used to reflect relative locationsand/or directions between various portions of an object.

In an aspect, the present disclosure provides an integrated compactoptical transceiver. As data transmission-capacities increase in WDMsystems, demand on high-speed, compact optical transceiver based onsilicon photonics platform increasingly attract more and more interestover the recent years. For example, a compact pluggable opticaltransceiver in QSFP form factor. Yet, the compact optical transceiver isstill a stand-alone device that needs to be coupled with separatepassive optical devices like mux/demux and one or more gear box orretimer to connect with an electrical switch device to form a functionallight engine, which requires a fairly large package size and highpower-consumption.

FIG. 1 shows a simplified block diagram of an integratedoptical-electrical module according to an embodiment of the presentinvention. This diagram is merely an example, which should not undulylimit the scope of the claims. One of ordinary skill in the art wouldrecognize many variations, alternatives, and modifications. As anembodiment shown in FIG. 1, the integrated optical-electrical module1000 is formed by integrating a silicon photonics optical transceivermodule 100 formed on a single silicon photonics substrate coupled with aplanar light circuit (PLC) block 200. In the embodiment, the opticaltransceiver module 100 is a 4-channel integrated optical transceiverconfigured to receive four wide-wavelength inputs demultiplexed from oneoptical input 221 and output four CWDM channel wavelength multiplexed toone light output 211. Both a 4-to-1 multiplexer 210 and a 1-to-4demutiplexer 220 are formed in the PLC block 200. Optionally, the PLCblock 200 includes multiple optical waveguides formed in a glasssubstrate.

Referring to FIG. 1, the (one of the four) optical transceiver module100 includes a bank of 4 CWDM lasers 110 respectively provide 4 CWDMchannel light signals with wavelengths in 1270 nm, 1290 nm, 1310 nm, and1330 nm. Optionally, each laser is a DFB laser. Optionally, each laseris provided as an individual laser chip flip-mounted on the siliconphotonics substrate. Optionally, each light signal outputted from therespective one laser chip is coupled into a silicon waveguide built inthe silicon photonics substrate. Each light signal, through thewaveguide, is firstly coupled into a power splitter 120 to be split totwo branches with a split ratio varying from 5:95 to 50:50. Optionally,the light signal from one minor split branch of the power splitter 120is used for monitoring or wavelength locking or feedback control.Optionally, the light signal from one major split branch of the powersplitter 120 is fed to one of four modulators 160. Optionally, forequally 50:50 splitting case, the light signal is converted to tworeplicated light signals respectively fed into a modulator. FIG. 1 onlyshows four modulators 160 respectively for four first branches (01)while four other modulators for the four second (replicated) branches(02) are not explicitly shown. Of course, there can be many functionalsetups to handle these light signals and configure in different mannersfor different applications of the optical-electrical module 100.

Optionally, the modulator 160 in any one of first branch 01 is a linearwaveguide-based Mach-Zehnder modulation scheme. Each modulator 160includes two waveguide branches with desired phase delay configured tomatch with respective one of four wavelengths 1270 nm, 1290 nm, 1310 nm,and 1330 nm of the four CWDM channels. A Driver module 150 is providedas an independently-built flip chip mounted on the same siliconphotonics substrate. Optionally, a redundant driver module 150′ (notshown in FIG. 1) is also provided as a flip-chip mounted on the samesilicon photonics substrate for driving the other four modulators (whichare not shown in FIG. 1). The driver module 150 is configured to driveall of the four modulators 160 to modulate the four channels of lightsignals respectively passing therethrough. Optionally, the driver module150 employs PAM-N(N is an integer) modulation protocol or NRZ modulationprotocol to modulate the light signal. For example, the modulators 160are configured to provide PAM4 modulation though other formats can beemployed. After modulation, the four channels of light signals areguided to a 4-to-1 multiplexer (Mux) 210 formed in the PLC block 200which outputs a multiplexed light signal through a fiber (not shown) tothe output port 211. Optionally, there is another 4-to-1 Mux formed inthe PLC block 200 (yet not shown) for combining the other 4 replicatedchannels of light signals to one multiplexed light signal which isthrough another fiber (not shown) led to the output port 211.Effectively, a combination of the 4 lasers 110 and 4 or 8 modulators 160driven by the driver module 150 or plus the driver module 150′ (see FIG.2) forms an integrated 4-ch optical transmit path plus another 4-chreplicated optical transmit path (not shown in FIG. 1).

Referring to FIG. 1, the optical transceiver module 100 includes a 4-choptical receive path. In the path, the optical de-multiplexer (Demux)220 in the PLC block 200 receives an incoming light signal from externalnetwork which is configured to operate under the four CWDM wavelengthsfor transmitting corresponding data signals. The incoming light signalis demultiplexed into 4 separate light signals in respective 4 channelwavelengths guided into respective four waveguides formed in the siliconphotonics substrate. High-speed photodetectors are used to detect thesefour light signals separately and converted to respective electricalsignals. In the embodiment, the 4-channel optical receive path of theoptical transceiver module 100 also includes a trans-impedance amplifierTIA module 140 for independently processing the electrical signalsconverted from respective four separate light signals for communicatingwith host electrical network system. Optionally, the optical transceivermodule 100 also includes a replicated 4-ch optical receive path as fourreplicated light signals can be demultiplexed from another incominglight by another demultiplexer. In the replicated 4-ch optical receivepath, another trans-impedance amplifier TIA module 140′ (not shown inFIG. 1) can be included for independently processing four electricalsignals converted from respective four replicated light signals forcommunicating with host electrical network system with expandedbandwidth. Optionally, the TIA module 140 is provided as a flip chipmounted on the same silicon photonics substrate. Optionally, the TIAmodule 140′ is a replicated flip chip mounted on the same siliconphotonics substrate (see FIG. 2).

Optionally, the integrated coherent optical transceiver includesmultiple silicon waveguides respectively laid in the silicon photonicssubstrate of the optical transceiver module 100 for connecting severaldifferent silicon photonics components including power splitter,photodetector, and modulator formed in the silicon photonics substrate,and passive optical multiplexer and demultiplexer in the PLC block 200.Optionally, the silicon waveguides have regular rectangular wire shapewith a fixed width and height. Optionally, the height is selected basedon a usage of standard 220 nm silicon-on-insulator (SOI) substrateduring its formation process. Optionally, the silicon waveguides havealternative shaped structures like rib structure with multiple steps inheight, taper structure with varying widths along its length, ormultiple branches of different widths and separations joined atdifferent cross-section planes, depending on specific functionalapplications. Optionally, some of the silicon photonics componentsmentioned above are also silicon waveguides themselves monolithicallyformed in a same manufacture process for preparing the silicon photonicssubstrate to integrate the optical transceiver module 100.

In another aspect, the present disclosure provides a compact assembly ofoptical-electrical modules integrating multiple optical transceivers andPLC blocks in one common substrate in a sealed package. FIG. 2 shows aschematic perspective view of a compact light engine assemblyintegrating four optical-electrical modules according to an embodimentof the present invention. This diagram is merely an example, whichshould not unduly limit the scope of the claims. One of ordinary skillin the art would recognize many variations, alternatives, andmodifications. As an embodiment shown in FIG. 2, the compact lightengine 2000 is provided by integrating four optical-electrical modules1000 based on silicon-photonics platform evenly packaged in four areason a common printed circuit board (PCB) substrate 2001.

Each of the four optical-electrical modules 1000 in FIG. 2 issubstantially a same one disclosed in the block diagram of FIG. 1including a silicon photonics (SiPho) transceiver module 100 and a PLCblock 200. The SiPho transceiver module 100 is formed on a singlesilicon photonics substrate including an optical transmission path withfour laser chips 110 configured to independently output laser signals atrespective four CWDM channel wavelengths, 1270 nm, 1290 nm, 1310 nm, and1330 nm designed for data communication. The four laser signalsoutputted from the laser chips 110 are guided via built-in waveguides(not explicitly shown) to four modulators 160 which are also formedwithin the silicon photonics substrate of the SiPho module 100.

Optionally, each of the four laser signals outputted from the laserchips 110 is respectively split by a 50:50 splitter to two light signalsrespectively guided to two transmit paths (see FIG. 1). In one transmitpath, the four light signals are passed through the four modulators 160(FIG. 1) which are driven by a flip chip driver 150 (FIG. 1 and FIG. 2).In another replicated transmit path, other four light signals are passedthrough four other modulators 160′ (not shown in FIG. 1) driven byanother flip chip driver 150′ (FIG. 2). Both the driver 150 and thedriver 150′ (FIG. 2) are interfaced with external electrical controlsystem respectively through two digital signal processing (DSP) chips2030 and 2030′ as well a microcontroller chip 2040 mounted on the samePCB substrate 2001. The modulators 160 are configured to modulate thefour light signals respectively from the laser chips and outputcorresponding modulated light signals to encode respective data thereinto be transmitted. The modulators 160′ independently modulate the fourreplicated light signals to output corresponding modulated light signalsto encode respective (additional) data therein to be transmitted.Optionally, the digital signal processing chips 2030 and 2030′ includegearbox for converting analog signal to digital signal, processor forprocessing the digital signals, interface device for communicating withexternal electrical network, and laser drivers for driving the fourlaser devices. Optionally, every controller chip 2040 is associated witha respective one optical-electrical module 1000 and is configured todrive the other chips and drivers therein. Optionally, the modulators160 or 160′ are configured to modulate the laser light signal based onPAM-N protocol, for example, PAM-4 protocol, or based on NRZ protocol.

The PLC block 200 associated with each of the four optical-electricalmodules 1000 includes a first optical multiplexer (see FIG. 1) tomultiplex the four light signals into one output light in an opticalfiber and a second optical multiplexer to multiplex the four replicatedlight signals into another output light in another optical fiber. Bothoptical fibers can be packaged into one on-board fiber cable 2011coupled between the PLC block 200 and a first optical port 2110 mountedon one side edge of an assembly wall structure 2100 of the compact lightengine 2000. In fact, the first optical port 2110 also is packaged twoother optical fibers carrying respective output lights from two transmitpaths of another of the four optical-electrical modules 1000 in thecompact light engine 2000. From the first port 2110, total four outputlight paths carrying 16 channel signals from two of the fouroptical-electrical modules 1000 can be delivered to external opticalnetworks. In the embodiment, the compact light engine 2000 includestotal four compact optical transceivers 1000. In a replicate fashion,four other output light paths carrying 16 channel signals receivedrespectively from other two of the four optical-electrical modules 1000in two on-board fiber cables (2011) are delivered through the secondport 2120 to the external optical networks.

As each of the four optical-electrical modules 1000 provides tworedundant transmit paths and each transmit path includes one set of fourlight channels that is multiplexed into one output, one opticaltransceiver in one of the four optical-electrical modules 1000 yields 8light channels. Totally, the compact light engine 2000 offers 32 outputlight channels. As shown in FIG. 2, among the 32 output light channels,16 of them from two of the four optical-electrical modules 1000 aredelivered through the first port 2110 and 16 others from other two ofthe four optical-electrical modules 1000 are delivered through thesecond port 2120.

In the embodiment, the same one of the four optical-electrical modules1000 (FIG. 2) also includes a built-in optical receive path in the SiPhotransceiver module 100 configured to receive four light signals passedvia an on-board fiber cable 2021 coupled from the PLC block 200 whichhas an optical demultiplexer to demultiplex an incoming light signal tofour individual lights with respective four CWDM channel wavelengths.Each of the four individual lights is coupled from the PLC block 200 tothe waveguides in the silicon photonics substrate to a photodetectorblock (referred to FIG. 1). The photodetector block individually detectsand converts each light to an electrical current passed to and processedby a trans-impedance amplifier (TIA) module 140, which is a flip chipmounted on the same silicon photonics substrate, to generate a voltagesignal. The voltage signal is further handled or digitized and processedby on-board Digital Signal Processing chip 2030 and fed to an externalelectrical receiver. The incoming light signal as mentioned above isreceived via an on-board fiber cable 2021 coupled to the first opticalport 2110 which may be connected through an in-coming optical fiber froman external optical network.

Optionally, the same optical-electrical module 1000 includes areplicated optical receive path in the SiPho transceiver module 100. Inthis replicated path, another incoming light signal can be received viaanother fiber packaged in the same on-board fiber cable 2021 (from thefirst port 2110. The light signal is demultiplexed to four replicatedlight signals with respective four CWDM channel wavelengths which can beseparately detected by photodetectors and corresponding electricalsignals. The electrical signals can be processed by a replicated TIAmodule 140′ that is mounted as flip chip on the same silicon photonicssubstrate. In this embodiment, PLC block 200 contains two 1-to-4 or one1-to-8 demultiplexers to create two sets of four light paths. For thecompact light engine 2000 containing four optical-electrical modules1000, totally there are 32 input light channels associated with twooptical ports (2110, 2120). Each port delivers 4 sets of input lightchannels respectively to two PLC blocks 200 respectively for twooptical-electrical modules 1000. The two sets of the four sets of inputlight channels delivered to one PLC block 200 in respective one of thefour optical-electrical modules 1000 are transported via two fiberspackaged in one on-board fiber cable 2021 before being demultiplexed.These two sets of input light channels contain two replicated sets offour light signals carrying four CWDM channel wavelengths.

FIG. 2A is an explosive diagram of a simplified version of a compactlight engine of FIG. 2 according to an embodiment of the presentdisclosure. Referring to FIG. 2A, a compact light engine package 2000A,which is only one portion of the compact light engine 2000 of FIG. 2with one optical-electrical module 1000 being illustrated in theexplosive view. The package 2000A includes an assembly having a top lidmember 2200A covering a peripheral side member 2100A located around aboundary of a printed circuit board (PCB) substrate 2001A. Optionally,the package 2000A is a quarter portion of an assembly of the compactlight engine 2000. In FIG. 2, the top lid member 2200A was removed sothat the features inside the package can be revealed. Yet, the top lidmember 2200A may be placed to seal the assembly. Optionally, the seal ishermetic. Optionally, the top lid member 2200A contains a heat sinkstructure 2201A. Optionally, the heat sink structure 2201A is configuredto form thermal contact with all four laser devices 110 in the package2000A. The PCB substrate 2001A of the compact light engine package 2000is served as a bottom member of the package 2000A. Optionally, the PCBsubstrate 2001A also is structured to allow heat being conductedeffectively through a bottom member or another substrate in anotherassembly in higher system level.

In one embodiment, referring to FIG. 2A again, the optical-electricalmodule packaged in the compact light engine package 2000A includes asilicon photonics module 100 mounted on the PCB substrate 2001A. Thesilicon photonics module 100 provides a common silicon photonicssubstrate for mounting four laser devices 110, two replicatedtransimpedance amplifiers (TIA) 140 and 140′ as well as two drivers 150and 150′. Some other feature devices including optical modulators,optical splitters, optical detectors are all built in the same siliconphotonics substrate associated with the silicon photonics module 100.The two TIA/Driver units in each optical-electrical module of thecompact light engine package 2000A is configured to handle reception andtransmission of signals in two replicated sets of 4 channels. Eachchannel is associated with a light signal in a CWDM channel wavelength.Optionally, the silicon photonics module 100 is formed as a single chipthat is flip mounted on the PCB substrate 2001A.

In the embodiment, the optical-electrical module packaged in the compactlight engine package 2000A also includes a PLC block 200 mounted on thePCB substrate 2001A along one side of the silicon photonics module 100.The PLC block 200 can be configured with multiple optical multiplexer ordemultiplexer waveguide devices and coupling features based on a glasssubstrate to couple input or output light from optical fibers withplanar light waveguides. Additionally, along another side of the siliconphotonics module 100, one or more ASIC chips, for example, digitalsignal processing (DSP) chip(s) 2030 (2030′), can be disposed andmounted as a flip chip on the PCB substrate 2001A. Each DSP chip 2030 or2030′ is configured to support functions of one TIA/driver unitincluding one TIA chip 140 and one driver chip 150 for processing ormodulating optical/electrical signals involving a 4-ch transceiver pathor another replicated TIA/driver unit including one TIA chip 140′ andone driver chip 150′ for processing or modulating optical/electricalsignals involving another replicated 4-ch transceiver path. Optionally,although not shown, an optical power splitter, multiple (e.g., eight)modulators and photodetectors, can also be formed within a commonsubstrate of the silicon photonics module 100. Furthermore, amicrocontroller chip 2040 is also flip-mounted to the PCB substrate2001A next to the DSP chip to support control functions of theoptical-electrical module. The chip mounting, including mounting of thesilicon photonics module 100, DSP chips 2030 (2030′), controller chip2040, PLC block 200, is done by flip-chip mounting of pre-fabricatedchip onto a front side of the PCB substrate 2001A via conductive bondingbumps 2009. Moreover, the PCB substrate 2001A, which is served as aquarter portion of bottom member of the package 2000A of the compactlight engine 2000, also opens its bottom side for mounting additionalfunctional chips for enhancing performance of the light engine. Forexample, additional ASIC chip 2050 is shown to be mounted at the bottomside of the PCB substrate 2001A via conductor-filed through-hole bumps2009.

In a specific aspect, the present disclosure provides a fabricationstructure of a silicon-photonics optical module based on asilicon-photonics TSV interposer. Optionally, as an example, the SiPhotransceiver module 2000 may be formed with the fabrication structureshown here though many alternatives or modifications can be made. FIG. 3is a schematic sectional view of a SiPho transceiver module based on asilicon photonics TSV interposer according to an embodiment of thepresent invention. As shown, an optical-electrical module 3000 isprovided in a single silicon photonics substrate. In an embodiment, eachSiPho transceiver module 100 in FIG. 2 may be formed as theoptical-electrical module 3000.

Referring to FIG. 3, the optical-electrical module 3000 includes asilicon substrate 400 including a front side and a back side and aplurality of through-silicon vias (TSVs) 430 formed in a first region ofthe silicon substrate 400. Each TSV 430 is configured to fill aconductor material ended with a conductive pad 437 at the front side anda conductive bump 436 at the back side. The optical-electrical module3000 further includes a coupler 464 suspended over a cavity 463 in thefront side. The cavity 463 is formed in a second region isolated fromthe first region after the plurality of TSVs 430 including the pads 437and the conductive bumps 436 is formed.

Additionally, the optical-electrical module 3000 includes a laser device4030 disposed in a trench 440′ in the second region of the front side.Optionally, the laser device 4030 is a DFB laser having at least anelectrode 4031 coupled directly with a solder pad 442 on an under-bumpmetallization structure 441 in the trench 440′.

Furthermore, the optical-electrical module 3000 includes a fiber 4040installed in a V-groove 450′ in the second region of the front side. Thefiber 4040 is configured to couple with the coupler 464 and the laserdevice 4030. Optionally, the fiber 4040 is fixed by a lid 4041.

Moreover, the optical-electrical module 3000 includes one or moreelectrical IC chips having electrodes coupled directly with some pads437 at the front side of the silicon photonics TSV interposer thatelectrically connected to some conductive bumps 436 at the back sidethrough the conductive material in the plurality of TSVs 430.Optionally, the one or more electrical IC chips include a transimpedanceamplifier (TIA) module 4010. Optionally, the TIA module is a flip chiphaving electrodes 4011 facing directly towards some conductive pads 437on the front side of the silicon photonics TSV interposer to form directelectrical connection without any wirebonds. Optionally, the one or moreelectrical IC chips include a driver module 4020 configured as a flipchip with multiple electrodes 4021 facing directly towards some otherconductive pads 430′ on the front side of the silicon photonics TSVinterposer to form direct electrical connection without any wirebonds.Optionally, the optical-electrical module 3000 further includes multiplemulti-layer capacitors formed in the front side of the silicon photonicsTSV interposer. Optionally, the optical-electrical module 3000 can beapplied as an on-board module coupled together with a gear box orretimer module.

In yet another aspect, the present disclosure provides a light enginebased on the silicon photonics on-board in-package optics assembly. FIG.4A is a schematic side view of a light engine in an on-board in-packageoptics assembly according to an embodiment of the present invention. Asshown, the light engine is provided with a switch device co-mounted on asame PCB with a Retimer/Optical-electrical module based on the siliconphotonics TSV interposer and a planar light circuit (PLC) blockdescribed herein. Optionally the switch device is provided as a chipindependently built and mounted on a printed circuit board (PCB)substrate through conductive bumps. Optionally, the switch device isconfigured to support high-speed multi-channel communication.Optionally, the Retimer/Optical-electrical module is at least partiallybased on the optical-electrical module 3000 shown in FIG. 3 integratedwith the PLC block.

Optionally, the Retimer/Optical-electrical module is formed on a siliconphotonics substrate which is directly mounted via conductive bumps onthe same PCB shared with the switch device chip. The electrical couplingbetween the switch device chip and the electrical devices in theRetimer/Optical-electrical module is achieved by a median-reach (MR)electrical interface E-interconnect embedded in the PCB substrate.

Optionally, the Retimer/Optical-electrical module is optically coupledto passive optical devices (mux and demux) formed in the PLC blockco-mounted on the PCB substrate. The PLC block is coupled via anon-board fiber to an optical connector. Optionally, one fiber serves aninput fiber connected between an input port of an optical demux devicein the PLC block and an input connector and one fiber serves an outputfiber connected between an output port of an optical mux device in thePLC block and an output connector.

In some embodiments, the on-board in-package light engine assembly asshown in FIG. 4 is configured to couple with an external optical networkto convert optical signal to electrical signal and to communicatethrough a XSR or USR electrical interface with low power consumption(1.0-2.0 pJ/bit) with an electrical network for data communicationapplication.

In still another aspect, the present disclosure provides a light enginebased on the silicon photonics integrated with a switch in a co-packagedoptics assembly. FIG. 4B is a schematic side view of a light engine witha switch co-integrated with an optical-electrical module in co-packagedoptics assembly according to an embodiment of the present invention. Asshown, the light engine is provided with a switch device co-integratedwith the optical-electrical module based on the silicon photonics TSVinterposer described herein and coupled with a PLC block. The lightengine uses host FEC to draw control signals without using gear box andretimer module. The optical-electrical module combined with the PLCblock is substantially a compact light engine 2000 shown in FIG. 2.On-board fibers may be needed to couple the PLC block in the lightengine to an optical connector for connecting incoming fiber to receivean input light signal from or out-going fiber to deliver output lightsignal to an external optical network. The switch device containsmultiple electrical channels (e.g., 512 channels) usingUltra-Short-Reach (USR) or Extra-Short-Reach (ESR) electricalinterconnects to communicate with multiple (e.g., 32) optical-electricalmodules in one setting. No gearbox or retimer is required for this lightengine and FEC (forward error correction) function can be implemented byhost. Power consumption associated with the light engine to communicatewith external electrical network for data communication application canbe lowered to 1.0 pJ/bit with a 56G electrical interface.

In yet still another aspect, the present disclosure provides anintegrated compact high-capacity light engine assembled on a same(switch) substrate according to a conceptual basis of a co-packagedoptics assembly shown in FIG. 4B. FIG. 5 shows a schematic perspectiveview of a multi-channel integrated light engine including one switchdevice integrated with multiple compact light engines in a co-packageoptics assembly according to an embodiment of the present invention.This diagram is merely an example, which should not unduly limit thescope of the claims. One of ordinary skill in the art would recognizemany variations, alternatives, and modifications. As an embodiment shownin FIG. 5, the multi-channel integrated light engine 5000 is provided byintegrating one switch device 5100 with 32 compact light engines 2000 ona common printed circuit board (PCB) configured as a switch substrate5001. In an embodiment, each compact light engine 2000 is substantiallythe same as one provided in FIG. 2.

Referring to FIG. 5, in an embodiment, the switch device is anindependently built chip configured to support multi-channel electricalsignal switching function and mounted in a central region 5101 on theswitch substrate 5001. The switch device 5100 is configured to have amedian-reach (MR) or short reach (SR) or ultra-short reach (USR)electrical interconnect 5110 through built-in conductive paths in theswitch substrate 5001 for coupling with each individual one of 32compact light engines 2000. Each compact light engine 2000 is arrangedcompactly along a peripheral region of the switch substrate 5001.Optionally, the switch substrate 5001 is a square shape with each sideon average being disposed with 8 compact light engines 2000 to maximizeusable space thereof. Optionally, the switch substrate 5001 forassembling 32 compact light engines at periphery region with a switchdevice in central region is configured to be in a compact size of 100mm×100 mm or less.

Referring to FIG. 5, each compact light engine 2000 is assembled on theswitch substrate 5001 by disposing first a light engine substrate 2001on a respective designed periphery region of the switch substrate 5001.Optionally, the light engine substrate 2001 is a separate PCB substrateindividually for assembling and testing this particular compact lightengine 2000. In this case, the compact light engine 2000 (on which thesilicon photonics substrate of the optical-electrical module 1000 ismounted) is co-mounted on the PCB substrate shared with the switchdevice 5100, making the multi-channel light engine 5000 an on-boardin-package optics assembly. Optionally, the light engine substrate 2001is just a part of the switch substrate 5001 itself, the compact lightengine 2000 is co-integrated with the switch device 5100 on the sameswitch substrate. The silicon photonics substrate of fouroptical-electrical module 1000 in the compact light engine 2000 isdirectly mounted on the switch substrate 5001, making the multi-channellight engine a co-packaged optics assembly.

Referring to FIG. 5, on the light engine substrate 2001 (or optionally,the light engine substrate 2001 is part of the switch substrate 5001),one or more silicon photonics chips 2004 including multiple integratedlaser chips are mounted on top coupling one or more PLC-based opticalmux/demux devices. Optionally, the silicon photonics chip 2004 isconfigured to be a SiPho transceiver module 100 of FIG. 2 formed on asilicon photonics substrate fabricated using processes and structuresdisclosed in FIG. 3. Further on the silicon photonics substrate,single/dual CMOS chips 2002 with integrated TIA/Driver functionaldevices are mounted. Optionally, on-board optical fibers are included inthis layer to connect the PLC blocks associated with one or more siliconphotonics chips are also mounted on the silicon photonics substrate.Lastly, a lid member 2200 with an integrated optical connector 2210 isdisposed on top to seal each compact light engine 2000.

FIG. 6 shows a simplified cross-sectional view of a section of themulti-channel light engine in the on-board in-package optics assemblyaccording to an embodiment of the present invention. This diagram ismerely an example, which should not unduly limit the scope of theclaims. One of ordinary skill in the art would recognize manyvariations, alternatives, and modifications. As shown, some structurefeatures of the assembly are revealed including a portion of the switchsubstrate 601 which serves a printed circuit board for the integratedlight engine 5000. It also shows a light engine substrate 610 attachedon top of the switch substrate 601, which serves a printed circuit boardfor the compact light engine 2000. Optionally, the light enginesubstrate 610 is not needed. Optionally, the light engine substrate 610and the switch substrate 601 are a same substrate. A silicon photonicssubstrate 630 is shown to be mounted on the light engine substrate 610and coupled electrically by some conductive slugs 611. Optionally, theslugs 611 are made by copper. On the silicon photonics substrate 630, anASIC chip 620 including TIA chip or Driver chip is mounted. Laser chips(not shown) for forming the compact light engine 2000 is also mounted onthe silicon photonics substrate 630. Also shown, several waveguides 638are formed in the silicon photonics substrate 630 to couple with theoptical connector 635 for either receiving or outputting light signals.The optical connector 635 is integrated with a lid member 640,optionally, made by steel or other metal materials. On the lid member640, a copper-based heatsink 650 can be formed to allow good thermalconduction to release heat generated by the laser chips or other ASICchips (DSP 2030, 2030′, controller 2040, ASIC 2050) in the compact lightengine 2000. Optionally, the heatsink 650 includes fin structure 651.

Referring back to the FIG. 5, the multi-channel light engine 5000assembles 32 compact light engines 2100. Each compact light engine 2100provides 1.6 Tbit/s data capacity, yielding a total 51.2 Tbit/scapacity. In particular, each compact light engine 2100 includes 4 SiPhotransceiver modules 100. Each transceiver module has 4 channels in CWDMoptical wavelengths and electrical inputs of 32 lanes. Assuming that amodule input channel speed of 25 Gbit/s, a reverse gearbox is needed togo from the switch with 256 channels×50 Gbit/s to 25 Git/s and a totalmodule capacity of 800 Gbit/s can be provided with PAM4 modulation. Inthe case shown in FIG. 5, with the module input channel speed being 50Gbit/s, a switch with 512 channels×50 Gbit/s will provide total modulecapacity of 1600 Gbit/s with PAM4 modulation. With the module inputchannel speed being increased to 100 Gbit/s, the total module capacitycan even reach 3200 Gbit/s with PAM4 modulation.

Optionally, the multi-channel light engine formed on the commonsubstrate member is part of a switch system apparatus. The switch systemapparatus is spatially disposed in a data center. Optionally, the datacenter is configured for a social networking platform, an electroniccommerce platform, an artificial intelligence platform, or a humantracking platform. Optionally, the data center is coupled to a pluralityof data centers spatially located throughout a geographical region.Optionally, the data center is owned by a commercial company or agovernment entity. Optionally, the common substrate member comprises aprinted circuit board configured with an electrical interface to asystem board member, an optical interface to the system board member,and a mechanical interface to the system board member.

While the above is a full description of the specific embodiments,various modifications, alternative constructions and equivalents may beused. Therefore, the above description and illustrations should not betaken as limiting the scope of the present invention which is defined bythe appended claims.

What is claimed is:
 1. An integrated optical transceiver comprising: asubstrate member having a surface region; an optical input port; anoptical output port; a transmitter unit provided on the surface regionand comprising: a set of four laser devices configured to output fourlaser lights; a set of four power splitter devices coupled to the fourlaser lights to split each of the four laser lights to two portionsleading to two replicated transmit paths, each transmit path including,a set of four modulator devices formed in the surface region andrespectively receiving corresponding one of the two portions of the fourlaser lights; a driver device coupled to the set of four modulatordevices and configured to drive each modulator device to modulate arespective one of the four laser lights; a multiplexer device configuredto couple the four laser lights and multiplex to one output lightcarrying the four wavelengths delivered to the optical output port; areceiver unit provided on the surface region with two replicated receivepaths, each receive path comprising: a demultiplexer device configuredto receive an input light from the optical input port and demultiplex tofour input optical signals; a photodetector device configured to receivethe four input optical signals and convert the four input opticalsignals to respective electrical signals; and a transimpedance amplifierdevice coupled to the photodetector device to process the electricalsignals to be transferred as electrical outputs; and a heterogeneousintegration configured using the substrate member, the transmitter unit,and the receiver unit to form a single silicon photonics device.
 2. Theintegrated optical transceiver of claim 1 wherein the substrate memberis a silicon-on-insulator substrate.
 3. The integrated opticaltransceiver of claim 1 wherein the laser diode chip comprises a DFBlaser configured to emit a laser in a wavelength set in a CWDM channel.4. The integrated optical transceiver of claim 1 wherein the modulatordevice comprises a Mach-Zehnder interferometer based on two branches ofsilicon-based waveguides.
 5. The integrated coherent transceiver ofclaim 4 wherein the modulator device is configured to modulate the laserlight in PAM-N or NRZ modulation protocol.
 6. The integrated opticaltransceiver of claim 1 wherein the driver device comprises a CMOS chipthat is flipped to mount on the surface region of the substrate member.7. The integrated optical transceiver of claim 6 wherein the driverdevice comprises 4 channels with an electrical input channel speed of 25Gbit/s.
 8. The integrated optical transceiver of claim 6 wherein thedriver device comprises 4 channels with an electrical input channelspeed of 50 Gbit/s.
 9. The integrated optical transceiver of claim 6wherein the driver device comprises 4 channels with an electrical inputchannel speed of 100 Gbit/s.
 10. The integrated optical transceiver ofclaim 1 wherein the power splitter device comprises a waveguide-baseddirect coupler embedded within the surface region.
 11. The integratedoptical transceiver of claim 1 wherein the transimpedance amplifierdevice comprises a CMOS chip that is flipped to mount on the surfaceregion of the substrate member.
 12. A compact light engine comprising: acase having a periphery wall member coupled with a top lid member and asingle printed circuit board configured as a bottom member; fouroptical-electrical modules respectively disposed on the single printedcircuit board, each optical electrical module comprising an integratedoptical transceiver of claim 1 including a transmitter unit and areceiver unit configured in a surface region of a silicon substrate; thetransmitter unit including four laser devices outputting four laserlights split to two replicated transmit paths and a driver device todrive four modulators to modulate the four laser lights to generate fouroutgoing light signals per each transmit path to output a transmissionlight; the receiver unit including two replicated receive paths, eachreceive path including a photodetector device and a trans-impedanceamplifier device to detect four incoming light signals and convert thefour incoming light signals to respective electrical signals; an inputfiber cable coupled to each receive path with an optical demultiplexerdevice per one of the four optical-electrical modules and an outputfiber cable coupled to each transmit path with an optical multiplexerdevice per the one of the four optical-electrical modules; and one ormore ASIC chips configured on the printed circuit board and electricallycoupled with the four optical-electrical modules.
 13. The compact lightengine of claim 12 wherein each optical electrical module comprises 4optical channels plus 4 replicated optical channels, each opticalchannel being associated with a wavelength determined by one of the fourlaser lights in respective one of 1270 nm 1290 nm, 1310 nm, and 1330 nmoutputted from the four laser devices.
 14. The compact light engine ofclaim 12 wherein the modulator device comprises a Mach-Zehnderinterferometer based on two branches of silicon waveguides formed in thesilicon substrate.
 15. The compact light engine of claim 14 wherein themodulator device is configured to modulate respective one of the fourlaser lights in NRZ modulation protocol or a PAM-N modulation protocol,where N is an integer.
 16. The compact light engine of claim 12 whereinthe driver device comprises a CMOS chip that is flipped to mount on thesilicon substrate.
 17. The compact light engine of claim 16 wherein thedriver device comprises 32 channels with an electrical input channelspeed of 25 Gbit/s NRZ to provide total 800 Gbit/s data transceivingcapacity per one optical-electrical module.
 18. The compact light engineof claim 16 wherein the driver device comprises 32 channels with anelectrical input channel speed of 50 Gbit/s to provide total 1.6 Tbit/sdata transceiving capacity per one optical-electrical module.
 19. Thecompact light engine of claim 16 wherein the driver device comprises 32channels with an electrical input channel speed of 100 Gbit/s to providetotal 3.2 Tbit/s data transceiving capacity per one optical-electricalmodule.
 20. The compact light engine of claim 12 wherein thetransimpedance amplifier device comprises a CMOS chip that is flipped tomount on the silicon substrate.
 21. The compact light engine of claim 12wherein the one or more ASIC chips comprises gearbox for convertinganalog signal to digital signal, processor for processing the digitalsignals, interface device for communicating with external electricalnetwork, and laser drivers for driving the four laser devices.
 22. Thecompact light engine of claim 12 wherein the one or more ASIC chipscomprises one or more digital signal processing chips andmicro-controller chip mounted on a front side of the printed circuitboard.
 23. The compact light engine of claim 12 wherein the one or moreASIC chips are mounted on a back side of the printed circuit board. 24.The compact light engine of claim 12 wherein the top lid membercomprises a heat sink forming a thermal contact with all four laserdevices in each of the four optical-electrical modules.
 25. Amulti-channel light engine in an optics assembly comprising: a commonsubstrate member comprising a periphery region and a central region; aswitch device disposed at the central region having a plurality ofelectrical interconnects embedded in the common substrate member;multiple compact light engines disposed along the periphery region tomaximize useable spaces of the common substrate thereof, each compactlight engine being coupled with the switch device via one or moreelectrical interconnects of the plurality of electrical interconnects,each compact light engine comprising: a case having a periphery wallmember coupled with a bottom substrate member and a top lid member; fouroptical-electrical modules mounted on a single printed circuit boardassociated with the bottom substrate member, each optical electricalmodule comprising an integrated optical transceiver of claim 1configured in a surface region of a silicon substrate including tworeplicated transmit paths including four splitters splitting four laserlights from four laser devices to two replicated sets of four lightsignals and two replicated receive paths receiving two independentincoming light signals; each transmit path including a driver device todrive four modulators to modulate one set of four light signals whichare multiplexed by an optical multiplexer device to one outgoingtransmission light carrying four wavelengths; each receive pathincluding a photodetector device and a trans-impedance amplifier deviceto detect a light signal demultiplexed by an optical demultiplexerdevice from one of the incoming light signals carrying four wavelengths,and convert each light signal to an electrical signal; a first fiber tocouple with an input waveguide of the optical demultiplexer device and asecond fiber to couple with an output waveguide of the opticalmultiplexer device; an optical connector integrated with the top lidmember and located at one side of the periphery wall member to couplewith each first fiber associated with each of the fouroptical-electrical modules and each second fiber associated with each ofthe four optical-electrical modules.
 26. The multi-channel light engineof claim 25 wherein the single printed circuit board associated witheach optical-electrical module of each compact light engine is mountedon the common substrate member.
 27. The multi-channel light engine ofclaim 26 wherein each of the compact light engine is associated with aretimer ASIC chip configured on the single printed circuit board. 28.The multi-channel light engine of claim 25 wherein the single printedcircuit board associated with each optical-electrical module of eachcompact light engine is part of the same common substrate member. 29.The multi-channel light engine of claim 25 wherein each of the multipleelectrical interconnects between the switch device and the respective ofthe multiple compact light engines comprises a MR interconnect, or a SRinterconnect, or USR interconnect, or XSR interconnect.
 30. Themulti-channel light engine of claim 25 wherein the multiple compactlight engines disposed along the periphery region comprises 32 compactlight engines packed along the periphery region of the common substratemember in a square shape.
 31. The multi-channel light engine of claim 30wherein the common substrate in square shape has a size of 100 mm×100 mmor less.
 32. The multi-channel light engine of claim 25 wherein theswitch device comprises 256 or 512 electrical input channels, eachchannel being configured with a channel speed of 25 Gbit/s, or 50Gbit/s, or 100 Gbit/s.
 33. The multi-channel light engine of claim 25wherein the common substrate member is a substrate for a switch systemapparatus, the switch system apparatus being spatially disposed in adata center.
 34. The multi-channel light engine of claim 33 wherein thedata center is configured for a social networking platform, anelectronic commerce platform, an artificial intelligence platform, or ahuman tracking platform.
 35. The multi-channel light engine of claim 33wherein the data center is coupled to a plurality of data centersspatially located throughout a geographical region.
 36. Themulti-channel light engine of claim 33 wherein the data center is ownedby a commercial company or a government entity.
 37. The multi-channellight engine of claim 25 wherein the common substrate member comprises aprinted circuit board configured with an electrical interface to asystem board member, an optical interface to the system board member,and a mechanical interface to the system board member.
 38. Themulti-channel light engine of claim 25 wherein the top lid member ofeach compact light engine comprises a heat sink structure configuredwith a thermal contact with at least all laser devices in each of fouroptical-electrical modules.